Surface Mount Device Package Types

Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame.

Surface mount device package types.

It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. The small outline integrated circuit soic plastic package is shown above. Micro surface mount device extended technology. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases.

A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. Ceramic flat pack clga. Chip array small scale ball grid array cbga. Surface mount device package types.

The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Ceramic pin grid array cpga graphic cqfp. Bump chip carrier bga. A very large number of different types of package exist.

Sot 223 small outline transistor. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process. Ceramic ball grid array cfp. A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case.

Ceramic land grid array see lga cpga. Concurrently as the device complexity increases the heat generated by operation.